ED Copper Foil for PCB

Classify

The ED copper foils for PCB can be divided into below parts:

(STD-E)- standard electrodeposited copper foil

(HD-E)-high ductility electrodeposited copper foil

(HTE-E)-high temperature elongation electrodeposited copper foil

(LP-E)-low profile electrodeposited copper foil

(VLP-E)-very low profile electrodeposited copper foil

Introduction

The roll shape (from 1/3oz to 2oz thickness)width. In usual, it is from 500mm to 1295mm, the max width could reach to 1370mm.

The normal sheet size is 1295mm*1295mm, 1295mm*1092mm, 1295mm*990mm. it also can be cut to the size as customer’s requirement.

1/3oz, 1/2oz, 1oz, 3oz, 12oz, 14oz are popular thickness, and we can also provide surface treatment service.

Feature

Perfect normal temperature storage performance

High temperature anti-oxidization performance

High temperature elongation performance

Being used in the production of the different double-face and multi-player printed circuit boards

Perfect physical characteristic of the fine and uniform crystal structure

Low profile, the high intensity,high peel strength

No cooper powder movement and the clear figures

Environment friendly production

Application

S-THE ED Copper Foils can be used in the production of the different double face and multiayer printed circuit boards.

VLP-HTE-HF ED Copper foil can be used in production of the extreme current PCBs which are used in the extremer circuits of the electric powder and the motor vehicles.