You are here: ED copper foil for Printed Circuit Board
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Type |
High temperature elongation (THE) ED Copper Foils |
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Thickness Range |
1/3oz/ft²to 2oz/ft²（nominal thickness 12μm~70μm） |
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Width Range |
550~1295mm |
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Performance |
The perfect normal temperature storage performance |
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The high temperature anti-oxidization performance |
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The high temperature elongation performance |
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Quality standard |
Reach the Ⅱ and Ⅲ requirements of the international standard IPC-4562 |
S-THE ED Copper Foil Characteristics
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Quality items |
General Technical Terms |
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1/3oz/ft²(12μm) |
1/2oz/ft²(18μm) |
1oz/ft²(35μm) |
2oz/ft²(70μm) |
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Area Weight (g/m²) |
102-112 |
145-161 |
280-305 |
560-610 |
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Tensile Strength (kg/m m²) |
Room Temperature |
≥30 |
≥30 |
≥30 |
≥28 |
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High temperature 180℃ |
≥17 |
≥17 |
≥17 |
≥20 |
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Elongation (%) |
Room Temperature |
≥3 |
≥3 |
≥5 |
≥10 |
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High temperature 180℃ |
≥2 |
≥2.5 |
≥3 |
≥5 |
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Surface Roughness (μm) |
Shiny Surface Ra |
≤0.43 |
≤0.43 |
≤0.43 |
≤0.43 |
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Matte Surface Rz |
≤6 |
≤7 |
≤10 |
≤12 |
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Peel Strength (kg/cm) |
≥1.1 |
≥1.2 |
≥1.8 |
≥2.2 |
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Leakage points (points/m²) |
≤5 |
No |
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High Temperature Anti-Oxidization Performance |
Treat in the 180℃ constant temperature for 60 minutes, there is no oxidation stain |
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