VLP-THE-HF-Products-

Heavy ED Copper Foil for Printed Circuit Board

Type	Very-low-profile, high temperature elongation, and heavy (VLP-THE-HF)ED copper foil
Thickness Range	3oz/ft²to 14oz/ft²(nominal thickness 105μm~490μm)
Width Range	1295mm(Max width)
Performance	The perfect physical characteristics of the fine and uniform crystal structure.
	The low profile, the high intensity, and high elongation.
	The high peel strength, no copper powder movement, the clear figure.

VLP- THE-HF ED Copper Foil Characteristics

Quality items		General Technical Terms
		3oz/ft²	4oz/ft²	5oz/ft²	6oz/ft²	7oz/ft²	8oz/ft²	10oz/ft²	12oz/ft²	14oz/ft²
		105μm	140μm	175μm	210μm	245μm	280μm	350μm	420μm	490μm
Area Weight (g/m²)		915 ±45	1220 ±60	1525 ±75	1830 ±90	2135 ±105	2440 ±120	3050 ±150	3660 ±180	4270 ±210
Tensile Strength (kg/m m²)	Room Temperature	≥28	≥28	≥28	≥28	≥28	≥28	≥28	≥28	≥28
Tensile Strength (kg/m m²)	High temperature 180℃	≥20	≥20	≥20	≥20	≥20	≥20	≥20	≥20	≥20
Elongation (%)	Room Temperature	≥10	≥10	≥10	≥10	≥10	≥20	≥20	≥20	≥20
Elongation (%)	High temperature 180℃	≥5	≥5	≥5	≥5	≥5	≥10	≥10	≥10	≥10
Surface Roughness (μm)	Shiny Surface Ra	≤0.43	≤0.43	≤0.43	≤0.43	≤0.43	≤0.43	≤0.43	≤0.43	≤0.43
Surface Roughness (μm)	Matte Surface Rz	≤5.1	≤5.1	≤5.1	≤5.1	≤5.1	≤5.1	≤5.1	≤5.1	≤5.1
Peel Strength (kg/cm)		≥1.0	≥1.0	≥1.0	≥1.1	≥1.1	≥1.2	≥1.2	≥1.2	≥1.2
High Temperature Anti-Oxidization Performance		No Oxidation and Discoloration (treat in the 180℃ constant temperature for 60 minutes)
Surface Quality		Uniform color, no copper blotch and contamination, smooth shearing Area, and no shear power or shear mark.